General Event

Digitalization for competitiveness for processing & packaging

Contact Person: Andrea Gozzi
  • 03 May 2022
  •  Italian
  • Event format: On-Site

03-06 May 2022 at Fiera Milano Rho, Italy

LicencedImage Depositphotos 2389640 XL

For the 2022 edition, IPACK-IMA will focus on the competitiveness of digital technology for its exhibiting companies: in collaboration with MindSphere World, a thematic itinerary will be created among the stands thanks to a project aimed at highlighting the success of application cases of Internet-of-Things technologies in the world of processing and packaging.

This innovation involves IPACK-IMA's most avant-garde digital exhibitors, who will present success cases of adoption of Edge and Cloud technologies as added value to their solutions.

The leading companies in the sector, Cavanna, Concetti, GEA, Goglio, ILPRA, IMS Technologies, Nadella, OCME, Partena, Robopac, Selematic and Stilmas, are the spokespersons of a competitive community on an international scale, also as regards digital innovation; together with the technological contributions of our "Digital native" members: 40Factory, Engineering, Miraitek4.0, RAM Elettronica, Retuner, Siemens.

Logo IpkDigital Mindsphere 100x47cm 02 Tavola disegno 1

Using data to optimize processes, reduce maintenance costs, increase productivity and save energy are some of the use cases offered to visitors by participating exhibitors.

The appointment is therefore at IPACK-IMA, which, thanks to the special IPACK-IMA Digital section, will give the opportunity to get to know the most innovative best practices of the Industrial IoT ecosystem. Therefore, not only a path through the exhibitors' stands, but also a series of workshops that, on May 4th, 5th and 6th, will see MindSphere World experts deepen together with End Users and OEMs the themes of digital development in processing & packaging.

The event is in italian - with live English translation.

00 MW

Contact us to get an invitation code!

Download the guide to our live use cases here


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